PHOTOSENSITIVE RESIN COMPOSITION FOR EXPOSURE WITH FAR ULTRAVIOLET RAY,申请号JP19960215731-传众专利搜索

PHOTOSENSITIVE RESIN COMPOSITION FOR EXPOSURE WITH FAR ULTRAVIOLET RAY

申请公布号：JPH1062995(A)

申请号：JP19960215731

申请日期：1996.08.15

申请公布日期：1998.03.06

申请人：

FUJI PHOTO FILM CO LTD

发明人：SATO KENICHIRO;KODAMA KUNIHIKO;UENISHI KAZUYA;AOSO TOSHIAKI

分类号：G03F7/004;G03F7/039;G03F7/30;H01L21/027;(IPC1-7):G03F7/039

主分类号：G03F7/004

摘要：PROBLEM TO BE SOLVED: To obtain a photosensitive resin compsn. having high transparency to light of short wavelength for exposure and satisfying photodegradability and high efficiency of acid generation by incorporating a specified N- hydroxymaleimide type sulfonate photo-acid generating agent and a resin having substituents increasing solubility to an alkali developer under an acid. SOLUTION: This photosensitive resin compsn. contains an N- hydroxymaleimide type sulfonate photo-acid generating agent represented by the formula and a resin having substituents increasing solubility to an alkali developer under an acid. In the formula, each of R1 and R2 is H, 1-6C alkyl or <=6C cycloalkyl, R1 and R2 may form a ring by bonding through an alkylene chain and R3 is alkyl, perfluoroalkyl, cycloalkyl or a substitution product of camphor. Since this compsn. has high transparency to light of 170-220nm wavelength and has high efficiency of acid generation at the time of exposure with light of 170-220nm wavelength, it is fit for exposure with light of 170-220nm wavelength.