Soldering components to support base

申请公布号：DE4405784(A1)

申请号：DE19944405784

申请日期：1994.02.23

申请公布日期：1995.08.24

申请人：

DAIMLER-BENZ AEROSPACE AKTIENGESELLSCHAFT, 80804 MUENCHEN, DE

发明人：RUST, STEFAN, DIPL.-ING., 89250 SENDEN, DE;ZAGARITS, ARMIN, DIPL.-ING., 89077 ULM, DE

分类号：B23K1/00;B23K1/012;H01L21/60;H05K3/34;(IPC1-7):B23K31/02

主分类号：B23K1/00

摘要：Components are soldered to a base by heating the base (23) to a temp (d) below the melting point of the solder (Q1) then heating the solder, the contacting surface of the base and the components to a second temp. at which the solder melts and a joint arises. Finally the joint is cooled to a temp. of (Q1) or below.

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