PROCEDIMENTO DI SELEZIONE DI FONDELLI IN LATERIZIO E MACCHINA PER ATTUARE IL PROCEDIMENTO

申请公布号：ITVE920033(A1)

申请号：IT1992VE00033

申请日期：1992.08.14

申请公布日期：1994.02.15

申请人：

SPIL IMPIANTI DI MARTINI GIANCARLO

发明人：MARTINI GIANCARLO

分类号：B28B;E04C

主分类号：B28B

- - Process for the Preparation of -Methylenelactones and -Substituted Hydrocarbylidene Lactones

METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT HAVING MULTILAYER WIRING STRUCTURE

KLEMMVORRICHTUNG ZUM LÖSBAREN VERBINDEN ZWEIER PROFILSTÜCKE

Radially operated pneumatic valve has two half-sections with rotation against each other to set the air flow from a pump ball to a double-action pneumatic cylinder for a stepped movement or blocking action

SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MOLDING DIE FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Abdichtungsmittel für Fahrzeugreifen

STAHLBLECH MIT HERVORRAGENDER FORMBARKEIT, WEITERVERARBEITUNGSVERPRÖDUNGSWIDERSTAND UND ROSTBESTÄNDIGKEIT FÜR ZWEITEILIGES BATTERIEGEHÄUSE

METHOD FOR DRIVING AROMA PHOTOGRAPH AND STICKER DISPENSING KIOSK

GREEN FLUORESCENT SUBSTANCE FOR LOW VOLTAGE AND PREPARATION METHOD THEREOF

COMPOSITION OF INSECT REPELLENT FOR THE FABRIC TREATMENT

PANTOGRAPH JACK HAVING JACK SUPPORT

POWER GENERATING SYSTEM BY BUOYANCY

METHOD FOR PRODUCING SUBSTITUTE FUEL AND APPARATUS THEREFOR

Stromrichterschaltung und Verfahren zur Ankopplung an ein elektrisches Versorgungsnetz

PHARMACEUTICAL COMPOSITION COMPRISING AN ANTIGEN

Connecting structure used in the production of a semiconductor chip support comprises a support material, a metallic through-hole arranged in the carrier material, a re-distributing layer, and a through-contact

Cylinder head mounting at the cylinder block of an IC motor has claws at the inlet and exhaust manifold flanges to engage recesses with screw bolts to dispense with conventional bolts and give more space for the gas channels

MACHINE FOR MAKING CONTINUOUS GRIDS FOR ELECTRIC ACCUMULATOR PLATES

Objektiv, insbesondere Projektionsobjektiv in der Halbleiter-Lithographie