SEMICONDUCTOR DEVICE,申请号JP19900307477-传众专利搜索

SEMICONDUCTOR DEVICE

申请公布号：JPH04177867(A)

申请号：JP19900307477

申请日期：1990.11.13

申请公布日期：1992.06.25

申请人：

MATSUSHITA ELECTRON CORP

发明人：ARAKAWA RYUTARO

分类号：H01L23/50;H05K3/34

主分类号：H01L23/50

摘要：PURPOSE:To eliminate solder wicking phenomenon and enable working efficiency to be improved by performing a treatment with a poor solder wetting property onto an upper part of a lead terminal. CONSTITUTION:A chip 1 of an integrated circuit, a tab 2, an insulation object container 3 of epoxy resin mold including these, and a lead terminal 4 whose one terminal is fixed at the insulation object container 3 and whose the other terminal is extended outward are provided and then aluminum or nickel is plated on a surface of a part 6 excluding a junction part 5 of the lead terminal 4 which is bent in U-character shape, thus resulting in a surface 7 with a poor solder wettability. Therefore, when mounting on a printed-circuit board, a part of the surface 7 with a poor solder wetting property prevents wicking of solder, prevents solder at the connection part from being lost, enables preliminary heating time to be reduced, and enables working efficiency to be improved.