IC card module.,申请号EP19890308034-传众专利搜索

IC card module.

申请公布号：EP0390996(A2)

申请号：EP19890308034

申请日期：1989.08.07

申请公布日期：1990.10.10

申请人：

MITSUBISHI DENKI KABUSHIKI KAISHA

发明人：KODAI, SYOJIRO C/O KITAITAMI SEISAKUSHO OF;OCHI, KATSUNORI C/O KITAITAMA SEISAKUSHO OF;BABA, FUMIAKI C/O ZAIRYO KENYUSHO OF

分类号：B42D15/10;G06K19/077;H01L23/28;H01L23/29;H01L23/31;H01L23/498;H05K3/28;H05K3/34

主分类号：B42D15/10

摘要：<p>An IC card mooule includes a substrate 12 one side of which is provided with a connection terminal 7; and a resin-sealed semiconductor IC 11 which has been previously sealed by a resin. This connection terminal and the resin sealed semiconductor IC are electrically connected to each other and are molded with a molding resin 17 in such a manner that they are covered with the molding resin so as to prevent at least the electrically-connected portion 16 between them from being allowed to appear. Accordingly, reliable modules can be efficiently manufactured, and such reliable modules can be readily mounted on IC card substrates.</p>