RESIN MOLDED TYPE SEMICONDUCTOR DEVICE

申请公布号：MY8600546(A)

申请号：MY19860000546

申请日期：1986.12.30

申请公布日期：1986.12.31

申请人：

HITACHI LTD.;HITACHI MICROCOMPUTER ENGINEERING LTD.

发明人：YUJI HARA;SATORU ITO;TATSUMO TOYA

分类号：H01L21/822;H01L21/31;H01L21/3205;H01L23/29;H01L23/31;H01L23/52;H01L23/58;H01L27/04;H01L29/40

主分类号：H01L21/822

摘要：A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

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