Method for removing surface layers

申请公布号：DE3834396(A1)

申请号：DE19883834396

申请日期：1988.10.10

申请公布日期：1990.04.12

申请人：

TELEFUNKEN ELECTRONIC GMBH, 7100 HEILBRONN, DE

发明人：EBERT, THOMAS, DIPL.-ING. (FH), 7092 ROSENBERG, DE

分类号：H01L21/306

主分类号：H01L21/306

摘要：The invention relates to a method for removing surface layers on semiconductor wafers, especially layers of wax or film (foil), wherein the surface layer is removed using a solvent. The invention provides for the method to include a precleaning step, a fine cleaning step, an intermediate cleaning step, a rinsing step and a drying step, and for the solvent to consist of xylol both for the precleaning step and for the fine cleaning step.

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