Bonding method and apparatus,申请号US19740445983-传众专利搜索

Bonding method and apparatus

申请公布号：US3941641(A)

申请号：US19740445983

申请日期：1974.02.26

申请公布日期：1976.03.02

申请人：

HELLER, JR., WILLIAM C.

发明人：HELLER, JR., WILLIAM C.;LEATHERMAN, ALFRED F.

分类号：B29C53/00;B29C65/00;B29C65/36;(IPC1-7):B29C27/04

主分类号：B29C53/00

摘要：An improved method and apparatus for bonding plastic materials includes placement of minute particles at the interface, either between the interface surfaces or within one or both of the interface materials. A particle-moving field, such as an alternating magnetic field where magnetic particles are employed, is created across the interface to directly and correspondingly impress the alternating magnetic field on the magnetic particles while the interface is in a generally movable or yielding state. The magnetic particles, either as a result of premagnetization or in response to the impressed magnetic field, form individual magnets which move to align themselves with the impressed field in accordance with the direction of the relative polarizations. The alternating magnetic field continuously moves the particles and by proper orientation causes them to oscillate, rotate or otherwise move within the fluid interface material to move and intermix the plastic material and thereby produce an improved interface bond between the materials. The agitation may also create a mechanical interlocking of the materials even though fusion may not be created. The magnetic particles may be selected to also respond to a radio-frequency magnetic field to rapidly generate heat and thus simultaneously create the fluid material at the interface with the material agitation. The magnetic particles may further include particles to reduce the reluctance of the flux path to increase the magnetic intensity.