Verbindungsvorrichtung und Verbindungsverfahren
申请公布号:DE69607692(T2)
申请号:DE1996607692T
申请日期:1996.07.05
申请公布日期:2000.11.23
发明人:BAUMERT, ERIC;CHAZELAS, JEAN
分类号:H01L21/60;H01L23/485;H01R4/18;H01R12/70;H05K3/34
主分类号:H01L21/60
摘要:The connection element includes a conducting component (2) made of a shape retaining material, with two regions intended to lie in contact with the two elements to be connected. The component is intended to connect the lower surface of a component (BGA) with a printed circuit (CI) by using a soldered joint (1) between the conducting component and upper component (BGA) and a further soldered joint (2) between the conducting component and the printed circuit. The surface of the component is readily wettable using a solder with a base of lead and tin. The component may be spherical or cylindrical, with a typical dimension of 0.5 mm.
Dispositivo de mistura termostática
Dispositivo transportador de toner
Equipamento e processo para a atomização de combustível líquido
Compostos mono- ou bicíclicos composição farmacêutica processo para a preparação dos compostos e uso
VERTICAL SUPPORTING STRUCTURE FOR BOLT AND MOUNTING METHOD FOR IT
INFORMATION STORAGE AND RETRIEVAL DEVICE
GUARNIZIONE A TENUTA FRONTALE PER CINGOLI CON RIPARO PER LA SPORCIZIA.
RUOTA A RAZZE, PARTICOLARMENTE PER BICICLETTE
Method of and Apparatus for Producing Large Metal Plates
METHOD FOR MANUFACTURING CAPACITOR OF SEMICONDUCTOR DEVICE
METHOD FOR FORMING CAPACITOR OF SEMICONDUCTOR MEMORY DEVICE
CUP DROPPING APPARATUS FOR VENDING MACHINE