INTEGRATED CIRCUIT DEVICE

申请公布号：JP2000183270(A)

申请号：JP19980361069

申请日期：1998.12.18

申请公布日期：2000.06.30

申请人：

HITACHI LTD

发明人：HARA ATSUSHI;KASAI MARIKO;YOKOTA HITOSHI;NAKAMURA ATSUSHI

分类号：H01L23/50;(IPC1-7):H01L23/50

主分类号：H01L23/50

摘要：<p>PROBLEM TO BE SOLVED: To reduce noise that is generated by an integrated circuit by reducing the inductance of the lead frame of the integrated circuit. SOLUTION: An inductance-reducing plate 1001 is arranged at the lower portion of a lead frame 1010 for feeding power and a lead frame 1020 for grounding with a proper distance. A ground potential is supplied to the inductance-reducing plate 1001. The effective inductance of the lead frame 1010 for feeding power can be drastically reduced by the mutual inductance between the lead frame 1010 for feeding power and the inductance-reducing plate 1001, thus suppressing noise.</p>

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