A METHOD AND DEVICE FOR CHIP ASSEMBLY,申请号WO1996SE01556-传众专利搜索

A METHOD AND DEVICE FOR CHIP ASSEMBLY

申请公布号：WO9720344(A1)

申请号：WO1996SE01556

申请日期：1996.11.27

申请公布日期：1997.06.05

申请人：

TELEFONAKTIEBOLAGET LM ERICSSON (PUBL);NYHOLM, LEIF, INGMAR

发明人：NYHOLM, LEIF, INGMAR

分类号：G02B6/42;H01L23/13;H01L23/498;H01L33/00

主分类号：G02B6/42

摘要：With the invention of simplifying an arrangement of a chip having at least one optical active surface and positioning the chip in a correct position in relation to an optical miniature capsule for optimum light transmission between an optical fibre and the optically active surface, the chip (1) is fastened on a foil substrate (9) which has at least one conductor (4) and which is provided with alignment marks and/or guide means (8) for correct positioning of the chip on the foil substrate and for correct positioning of the foil substrate/chip assembly on the capsule. After having fastened the chip on the foil substrate, the foil with the chip can be readily fastened to the capsule and by that means the chip will be fastened to the capsule. By using guide means, for instance contact element guide pins on the capsule, the foil substrate/chip assembly can be positioned correctly in relation to the capsule, such that the ends of the optical fibres in the contact element will lie opposite to and in contact with the optically active surfaces of the chip and therewith provide optimum light transmission.