HIGH-TEMPERATURE LEAD-FREE SOLDER ALLOY

申请公布号：JPH11151591(A)

申请号：JP19970318103

申请日期：1997.11.19

申请公布日期：1999.06.08

申请人：

TDK CORP

发明人：SATO KATSUYUKI;OKAZAKI KOICHIRO

分类号：B23K35/26;H05K3/34;(IPC1-7):B23K35/26

主分类号：B23K35/26

THIN FILM TYPE THERMAL HEAD AND MANUFACTURE THEREOF

HEAT TRANSFER RECORDER

PRINTER

TREATMENT OF ACID RAIN

TREATMENT OF WASTE WATER CONTAINING AMMONIUM NITRATE

MANUFACTURE OF POWDER EPOXY RESIN-COATED STEEL PIPE

WAX APPLYING METHOD

MACHINING CONTROL APPARATUS IN A MACHINE TOOL

APPARATUS AND METHOD TRANSMITTING/RECEIVING DATA THROUGH CHANNELS TO HAVE CLEAR CHANNEL CAPABILITY

MAGNETIC RECORDING CARRIER

AGENT ANTIMICROBIEN

POSITION SIGNAL DECODING CIRCUIT

AC ADAPTER FOR POWER SUPPLY

SYSTEM FOR CONTROLLING PLURAL CACHES

ELECTRONIC DISK SUBSYSTEM

VAPOR GROWTH DEVICE

PRODUCTION OF MAGNETIC RECORDING MEDIUM

PUBLIC TELEPHONE SET

INTER-PROCESS CODE SHARING SYSTEM

METHOD OF PAINTING