RADIATION SENSITIVE RESIN COMPOSITION,申请号JP19950130837-传众专利搜索

RADIATION SENSITIVE RESIN COMPOSITION

申请公布号：JPH08328254(A)

申请号：JP19950130837

申请日期：1995.05.29

申请公布日期：1996.12.13

申请人：

OKI ELECTRIC IND CO LTD

发明人：ITO TOSHIO

分类号：G03F7/004;G03F7/032;G03F7/039;H01L21/027;(IPC1-7):G03F7/039

主分类号：G03F7/004

摘要：PURPOSE: To obtain a novel radiation sensitive resin compsn. having high sensitivity to radiation and high resolution. CONSTITUTION: Partially tetrahydropyran-2-ylated poly (hydroxystyrene) is produced as a 1st component by protecting 60% of the hydroxyl groups of poly(hydroxystyrene) as phenolic resin with tetrahydropyran2-yl groups of an acetal group and 1.7g of the 1st. component, 528mg t-butyl naphthalenesulfonate as sulfonic ester acting as a dissolution inhibitor as a 2nd component and 22mg triphenylsulfonium triflate acting as an acid generating agent as a 3rd component are dissolved in 6.0ml cyclohexanone as a solvent to prepare a resist.