MULTILAYER PRINTED WIRING BOARD HAVING FILLED-VIA STRUCTURE,申请号KR20067015985-传众专利搜索

MULTILAYER PRINTED WIRING BOARD HAVING FILLED-VIA STRUCTURE

申请公布号：KR20060095785(A)

申请号：KR20067015985

申请日期：2006.08.08

申请公布日期：2006.09.01

申请人：

IBIDEN CO., LTD.

发明人：SHIRAI SEIJI;SHIMADA KENICHI;ASAI MOTOO

分类号：H05K3/46;H05K3/10;H05K3/38;H05K3/42

主分类号：H05K3/46

摘要：<p>A multilayer printed wiring board having a filled-via structure, advantageous to form a fine circuit pattern and excellent in the resistances to cracking in heat cycles and to thermal shock. Conductor circuits and resin insulating layers are alternately formed in multilayer, via holes are formed in the interlayer insulating resin layer, the surface of a plating layer exposed in the opening part of each via hole is flat and substantially flush with the surface of the conductor circuit, the thickness of the conductor circuit is less than half the diameter of the via holes, the inner wall of the opening part of the interlayer insulating resin layer is roughened, an electroless plating film is formed over the roughened wall surfaces, and each via hole is filled with an electroplating material, thus completing the via holes. The insulating resin of the interlayer resin insulating layer is a composite material of a fluorocarbon resin having an excellent fracture toughness and a heat- resistant thermoplastic resin, a composite material of a fluorocarbon resin and a thermosetting resin, or a composite material of a thermosetting resin and a heat-resistant thermoplastic resin.</p>