DECOMPRESSION PROCESSING APPARATUS,申请号JP20150051884-传众专利搜索

DECOMPRESSION PROCESSING APPARATUS

申请公布号：JP2016171291(A)

申请号：JP20150051884

申请日期：2015.03.16

申请公布日期：2016.09.23

申请人：

DISCO ABRASIVE SYST LTD

发明人：IIDA HIDEKAZU

分类号：H01L21/3065;B65G49/07;H01L21/677;H01L21/683

主分类号：H01L21/3065

摘要：PROBLEM TO BE SOLVED: To allow a wafer to be separated from an electrostatic chuck and conveyed, without providing any special mechanism for carrying out the wafer to a plasma processing apparatus.SOLUTION: Application of a high frequency voltage between an electrostatic chuck 3 and an upper electrode is stopped after processing a wafer W. The suction holding surface 81 of a conveyance pad 8 is brought into contact with the upper surface W1 of the wafer W, and the wafer W is connected with the earth. Positive charges on the upper surface W1 of the wafer W are then removed, and the suction holding surface 81 is interconnected with a suction source 86 thus suction holding the wafer W. Thereafter, drive means 87 separates a plate-like work W from the electrostatic chuck 3 and carries out the wafer W from a chamber.SELECTED DRAWING: Figure 8