Semiconductor device and methods of manufacturing semiconductor devices,申请号US201313752800-传众专利搜索

Semiconductor device and methods of manufacturing semiconductor devices

申请公布号：US9455161(B2)

申请号：US201313752800

申请日期：2013.01.29

申请公布日期：2016.09.27

申请人：

Intel Deutschland GmbH

发明人：Meyer Thorsten

分类号：H01L23/06;H01L21/56;H01L21/683;H01L23/13;H01L23/498;H01L23/538;H01L23/00;H01L23/488

主分类号：H01L23/06

代理机构：

Blakely, Sokoloff, Taylor & Zafman LLP

代理人：Blakely, Sokoloff, Taylor & Zafman LLP

地址：Neubiberg DE

摘要：This application relates to a semiconductor device comprising a semiconductor chip, a molded body covering the semiconductor chip, wherein the molded body comprises an array of molded structure elements, and first solder elements engaged with the molded structure elements.

主权项：1. A semiconductor device comprising: a semiconductor chip; a molded body at least partially covering the semiconductor chip, the molded body including at least one cone-shaped protrusion, wherein the semiconductor chip includes at least a surface having a first connection element, the surface having the first connection element being uncovered by the molded body, the molded body having a mold surface, the mold surface and the surface having the first connection element defining a coplanar plane; and a solder element placed over the at least one cone-shaped protrusion of the molded body.