Host side and module side circuit boards connecting structure for e.g. communication apparatus, has transmission path provided between connection terminals, where path is coplanar line with corresponding characteristic impedance,申请号FR20080055609-传众专利搜索

Host side and module side circuit boards connecting structure for e.g. communication apparatus, has transmission path provided between connection terminals, where path is coplanar line with corresponding characteristic impedance

申请公布号：FR2930398(A1)

申请号：FR20080055609

申请日期：2008.08.18

申请公布日期：2009.10.23

申请人：

MITSUBISHI ELECTRIC CORPORATION

发明人：SAWADA TAZUSHIGE

分类号：H05K1/14

主分类号：H05K1/14

摘要：<p>The structure has circuit boards (12, 14) respectively inserted into insertion openings (13, 15) of a connector (11). Recto and verso patterned conductors (21, 22) are connected to respective recto and verso side connection terminals (17, 18) and formed on the board (12). Other recto and verso patterned conductors (23, 24) are connected to respective recto and verso side connection terminals (19, 20) and formed on the board (14). A transmission path from the former terminals to the latter terminals is a coplanar line with corresponding characteristic impedance.</p>