贴着式手机套

申请公布号：TWM421023

申请号：TW100213996

申请日期：2011.07.29

申请公布日期：2012.01.21

申请人：

陈明发

发明人：陈明发

分类号：A45C11/00

主分类号：A45C11/00

代理人：卢信智 台南市中西区成功路515号9楼

地址：台南市北区文成二街46号

主权项：一种贴着式手机套，包括一片体，由一体相摺而界定为一第一层部与一第二层部，该第一层部与该第二层部各自于自由端设有一相互对合之结合件，该第二层部之内侧设有一黏着层，藉以提供手机黏合。如申请专利范围第1项所述之贴着式手机套，其中该第二层部于该黏着层范围内设一指穿孔。如申请专利范围第1项所述之贴着式手机套，其中该第二层部于该黏着层表面贴附一离型膜。如申请专利范围第1项所述之贴着式手机套，其中该第二层部于该黏着层范围外设一穿孔。如申请专利范围第1项所述之贴着式手机套，其中该黏着层为压敏胶。

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