Lead frame and method for fabricating resin-encapsulated semiconductor device using the same,申请号EP20010114674-传众专利搜索

Lead frame and method for fabricating resin-encapsulated semiconductor device using the same

申请公布号：EP1239517(A3)

申请号：EP20010114674

申请日期：2001.06.19

申请公布日期：2004.09.22

申请人：

MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人：UTSUMI, MASAKI;FUNAKOSHI, MASASHI;HAMATANI, TSUYOSHI;MORIKAWA, TAKESHI;NAKABAYASHI, YUKIO

分类号：H01L23/28;H01L21/56;H01L21/68;H01L23/12;H01L23/31;H01L23/495;H01L23/50

主分类号：H01L23/28

摘要：A lead frame includes: an outer frame section; a plurality of chip mounting sections which are supported by the outer frame section and on which a plurality of semiconductor chips are mounted; lead sections surrounding the chip mounting sections; connecting sections for connecting and supporting the lead sections and the outer frame section with each other; and an encapsulation region in which the chip mounting sections are encapsulated together in an encapsulation resin. An opening is provided in a plurality of regions of the outer frame section that are each located outside the encapsulation region and along the extension of one of the connecting sections. <IMAGE>