APPARATUS FOR LEVELING A SEMICONDUCTOR WAFER,申请号KR20060045966-传众专利搜索

APPARATUS FOR LEVELING A SEMICONDUCTOR WAFER

申请公布号：KR20070112923(A)

申请号：KR20060045966

申请日期：2006.05.23

申请公布日期：2007.11.28

申请人：

SAMSUNG ELECTRONICS CO., LTD.

发明人：LEE, JAE PIL

分类号：H01L21/027

主分类号：H01L21/027

摘要：<p>An apparatus for leveling a semiconductor wafer is provided to adjust the intensity of light by moving one of the concave and convex lenses according to the size of an exposure region. An apparatus for leveling a semiconductor wafer includes a light emitting unit(110) and first and second optical arrays(120,130). The light emitting unit generates the light which is irradiated on an exposure region on a semiconductor substrate. The first optical array is arranged between a light source and the substrate and adjusts a spot size of the light so that the light generated from the light source substantially corresponds to a first directional size of the exposure region. The second optical array is arranged between a first optical array and the substrate and adjusts the spot size of the light so that the light passed through the first optical array substantially corresponds to a second directional size of the exposure region.</p>