PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME,申请号JP20070046262-传众专利搜索

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

申请公布号：JP2008210993(A)

申请号：JP20070046262

申请日期：2007.02.26

申请公布日期：2008.09.11

申请人：

NEC CORP;YAMANASHI NIPPON DENKI KK

发明人：FUKUTOMI YASUHIRO;MINODA TOMOJI;KOIKE MOTONOBU

分类号：H05K3/34;H05K1/14;H05K1/18;H05K3/36

主分类号：H05K3/34

摘要：PROBLEM TO BE SOLVED: To provide a printed wiring board having a structure capable of reducing the spacing between the pads for surface mounting and wherein an FPC can be mounted simultaneously with an electronic component by a reflow method even when the FPC is mounted, and to provide a method of manufacturing the same. SOLUTION: A solder resist 3 is formed on the surface so that the pads 2 are exposed, a solder resist 4 is formed between adjacent counterpart pads, and solder paste having a height not lower than that nearly same as the solder resist 4 is arranged by printing on the pad 2 spaced from the other pads 2 by the solder resist 3 and the solder resist 4. COPYRIGHT: (C)2008,JPO&INPIT