REFLOW METHOD FOR SOLDER BUMP

申请公布号：JP2016157766(A)

申请号：JP20150033658

申请日期：2015.02.24

申请公布日期：2016.09.01

申请人：

TAMURA SEISAKUSHO CO LTD

发明人：SAKAMOTO ISAO;SHIBASAKI MASANORI

分类号：H01L21/60;B23K1/00;B23K31/02;H05K3/34

主分类号：H01L21/60

摘要：PROBLEM TO BE SOLVED: To provide a reflow method for a solder bump, enabling voids of solder bumps formed on a workpiece to be efficiently reduced.SOLUTION: The reflow method for a solder bump is provided that comprises: a step of applying flux onto the surface of bumps formed on a workpiece; a step of heating the flux at a first pressure; a step of reducing pressure around the workpiece to a second pressure lower than the first pressure after the temperature of the heated flux becomes equal to or higher than that in the vicinity of liquid phase temperature of a solder alloy constituting solder bumps; and a step of increasing the pressure around the workpiece to a third pressure higher than the second pressure while the heating temperature becomes equal to or higher than the liquid phase temperature of the solder alloy. The reflow method for a solder bump is characterized in that the step of reducing the pressure to the second pressure and the step of increasing the pressure to the third pressure are performed more than once.SELECTED DRAWING: Figure 1

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