NEGATIVE WATER-SOLUBLE PHOTOSENSITIVE RESIN COMPOSITION,申请号JP20010144016-传众专利搜索

NEGATIVE WATER-SOLUBLE PHOTOSENSITIVE RESIN COMPOSITION

申请公布号：JP2002341530(A)

申请号：JP20010144016

申请日期：2001.05.14

申请公布日期：2002.11.27

申请人：

TOKYO OHKA KOGYO CO LTD

发明人：TAKANASHI HIROSHI;KUDOU TOMOYA;OBATA TAKEKAZU

分类号：G03F7/027;C08F290/04;G03F7/038

主分类号：G03F7/027

摘要：PROBLEM TO BE SOLVED: To provide a negative water-soluble photosensitive resin composition which is a non-chromium photosensitive resin composition as a substitute for a conventional chromium-based water-soluble photosensitive resin composition, and in particular, which is preferably used for the formation of photomasks for etching metal substrates in the manufacture of shadow masks for CRTs, lead frames for IC chip mounting, or the like, and which has excellent water resistance of the film and durability against etching even though the composition can be developed with water. SOLUTION: The negative water-soluble photosensitive resin composition contains (A) a water-soluble polymer containing a structure unit having carboxyl groups and a structural unit having at least one ethylenic double bond in the side chains, (B) a compound containing (meth)acrylamide methylene groups, which is obtained by the reaction of a compound having at least one alcoholic hydroxyl group in the molecule and, N-methylol (meth)acrylamide, C1-4 alkoxymethyl (meth)acrylamide in the presence of a strong acid catalyst, and (C) a photopolymerization initiator.