JIG FOR FLOW SOLDERING,申请号JP20010377697-传众专利搜索

JIG FOR FLOW SOLDERING

申请公布号：JP2003179339(A)

申请号：JP20010377697

申请日期：2001.12.11

申请公布日期：2003.06.27

申请人：

KIKUDEN INTERNATIONAL KK;TAISEI:KK

发明人：KIKUCHI FUMITAKE

分类号：B23K3/00;B23K101/42;H05K3/34;(IPC1-7):H05K3/34

主分类号：B23K3/00

摘要：PROBLEM TO BE SOLVED: To provide a jig for flow soldering capable of eliminating the need of the work of adjusting the width of a carrying conveyor of a flow soldering device, freely coping with a difference of the outer shape dimension width of a printed board and simultaneously holding one or more printed boards. SOLUTION: The jig (500) for flow soldering for clamping and carrying the printed board (80) during flow soldering is provided with an outer frame (A) and one or more printed board holding members (B) and both end parts of the printed board holding member (B) are attached so as to be slid on two sides facing each other of the outer frame (A). Thus, by the outer frame (A) and the printed board holding member (B) or the two printed board holding members (B), at least two sides of one or more printed boards are clamped and the printed boards are held almost horizontally to the outer frame (A). COPYRIGHT: (C)2003,JPO