Flexible multi-layer polyimide film laminates and preparation thereof

申请公布号：US5411765(A)

申请号：US19930168866

申请日期：1993.12.14

申请公布日期：1995.05.02

申请人：

E. I. DU PONT DE NEMOURS AND COMPANY

发明人：KANAKARAJAN, KUPPUSAMY;KREUZ, JOHN A.

分类号：B32B15/08;B32B15/088;B32B27/34;C08G73/10;H05K1/00;H05K1/03;H05K3/38;(IPC1-7):B05D3/02;B05D3/10

主分类号：B32B15/08

摘要：A process of making flexible multilayer polyimide metal-clad laminates, and their preparation, having at least one layer of aromatic polyimide bonded to at least one layer of a metallic substrate using a heat-sealable copolyimide adhesive containing repeating imide units derived from 4,4'-oxydiphthalic dianhydride and an aromatic ether diamine. The laminates are used in flexible printed circuits and tape automated bonding applications. Additionally, the metallic substrate may be directly coated with the copolyimide adhesive and used as a single-clad laminate for flexible printed circuits.

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