CONNECTION-HEIGHT CONTROL METHOD AND METHOD AND APPARATUS FOR ASSEMBLING PACKAGE,申请号JP20020114053-传众专利搜索

CONNECTION-HEIGHT CONTROL METHOD AND METHOD AND APPARATUS FOR ASSEMBLING PACKAGE

申请公布号：JP2003309141(A)

申请号：JP20020114053

申请日期：2002.04.17

申请公布日期：2003.10.31

申请人：

MATSUSHITA ELECTRIC IND CO LTD

发明人：MATSUMURA SHINYA;TAKEOKA YOSHIAKI;SUGANO JUNICHI;TAKEMURA YASUSHI;ISHIKAWA KAZUHIRO

分类号：H01L21/60;(IPC1-7):H01L21/60

主分类号：H01L21/60

摘要：PROBLEM TO BE SOLVED: To provide a connection-height control method in which a connection height influencing the quality of connection is controlled and confirmed in a short time when a package is assembled by using a connection technique by a pressure welding operation. SOLUTION: A diameter D at the tip of a bump electrode 2 in a pressure- welded state is measured from the other face 4b facing one face 4a of a board 4, and a pressure welding condition used to obtain a proper connection height H between a semiconductor element 1 and the board 4 is decided on the basis of a correlation between the diameter at the tip of the bump electrode 2 and the connection height. COPYRIGHT: (C)2004,JPO