OPTICALLY-ENABLED INTEGRATED CIRCUIT PACKAGE,申请号CA20072685971-传众专利搜索

OPTICALLY-ENABLED INTEGRATED CIRCUIT PACKAGE

申请公布号：CA2685971(C)

申请号：CA20072685971

申请日期：2007.05.07

申请公布日期：2017.02.07

申请人：

REFLEX PHOTONICS INC.

发明人：FU, SHAO-WEI;MAINARDI, RICHARD;ROLSTON, DAVID ROBERT CAMERON

分类号：G02B6/42;G02B6/43;H01L23/00;H01L23/50

主分类号：G02B6/42

摘要：An optically-enabled integrated circuit (IC) package for connecting an electrical circuit board to an optical fiber is presented. The IC package comprises an OSA having a laser which is pre-aligned with the optical fiber. The OSA further comprises a standard electrical interface for the connection to the microchip and a standard optical interface for the connection to the optical fiber. A set of mechanical concepts for connecting optical connectors and cables to integrated circuit packages is also presented and can be applied for any type of optical connector such as single optical fiber ferrules, MT-RJ type optical ferrules and 2-D MT-type optical ferrules.