METHOD FOR MANUFACTURING EMBEDDED COMPONENT SUBSTRATE, AND EMBEDDED COMPONENT SUBSTRATE MANUFACTURED USING THIS METHOD,申请号EP20120884630-传众专利搜索

METHOD FOR MANUFACTURING EMBEDDED COMPONENT SUBSTRATE, AND EMBEDDED COMPONENT SUBSTRATE MANUFACTURED USING THIS METHOD

申请公布号：EP2897447(A4)

申请号：EP20120884630

申请日期：2012.09.11

申请公布日期：2016.05.25

申请人：

MEIKO ELECTRONICS CO., LTD.

发明人：YAMAKI, AKIRA;KIKUCHI, TATSUYA;TODA, MITSUAKI

分类号：H05K3/46;H01L21/48;H01L21/60;H01L21/683;H01L23/544;H05K1/02;H05K3/34

主分类号：H05K3/46

摘要：A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component (14) with reference to a mark (12) formed on a copper layer (4), the mark (12) consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component (14) on the copper layer (4) with an adhesive layer (18) interposed therebetween, embedding the electronic component (14) and the mark (12) in an insulating substrate (34), thereafter, etching and removing a part of the copper layer (4) to form a window (W1) for exposing the mark (12), forming an LVH (46) reaching a terminal (20) of the electronic component (14) with reference to the exposed mark (12), electrically connecting the terminal (20) and the copper layer (4) via a conduction via (47) formed by applying copper plating to the LVH (46), and, thereafter, forming the copper layer (4) into a wiring pattern (50).