Ionic cooling assembly for electronic device,申请号US201314038053-传众专利搜索

Ionic cooling assembly for electronic device

申请公布号：US9337628(B2)

申请号：US201314038053

申请日期：2013.09.26

申请公布日期：2016.05.10

申请人：

Intel Corporation

发明人：Ploeg Johan;Pidwerbecki David

分类号：H01T23/00;H05F3/00;G06F1/20;H05K7/20

主分类号：H01T23/00

代理机构：

Alpine Technology Law Group LLC

代理人：Alpine Technology Law Group LLC

地址：Santa Clara CA US

摘要：In one embodiment an ionic airflow system comprises an anode, a cathode platform having an elongated surface, and a first ultrasonic transducer to direct ultrasonic waves into the cathode platform. Other embodiments may be described.

主权项：1. An ionic airflow system, comprising: an anode; a cathode platform having an elongated surface; and a first ultrasonic transducer to direct ultrasonic waves into the cathode platform.