Optical interconnection to an integrated circuit,申请号US201213632687-传众专利搜索

Optical interconnection to an integrated circuit

申请公布号：US9319148(B2)

申请号：US201213632687

申请日期：2012.10.01

申请公布日期：2016.04.19

申请人：

Lenovo Enterprise Solutions (Singapore) Pte. Ltd.

发明人：Kerrigan Brian M.;Miller Michael S.;Weiss Jonas R.

分类号：H04B10/80

主分类号：H04B10/80

代理机构：

Law Office of Jim Boice

代理人：Law Office of Jim Boice

地址：Singapore SG

摘要：A system comprises an interposer positioned between an integrated circuit and a system planar. An electrical/optical transceiver is coupled to the interposer, wherein the electrical/optical transceiver converts electrical signals into optical signals. The interposer comprises a first set of electrical conductors that is electrically coupled to non-Input/Output (I/O) electrical connectors on the integrated circuit, and wherein the first set of electrical conductors passes through the interposer to directly connect the non-I/O electrical connectors on the integrated circuit to the system planar. The interposer further comprises a second set of electrical conductors that is electrically coupled to input/output (I/O) electrical connectors on the integrated circuit, wherein the second set of electrical conductors traverses through the interposer to the electrical/optical transceiver to convert electrical I/O signals from the integrated circuit into optical I/O signals.

主权项：1. A system comprising: an interposer positioned between an integrated circuit and a system planar; an electrical/optical transceiver coupled to the interposer, wherein the electrical/optical transceiver converts electrical signals into optical signals; a first set of electrical conductors in the interposer, wherein the first set of electrical conductors is electrically coupled to integrated circuit (IC) non-Input/Output (I/O) electrical connectors on the integrated circuit, and wherein the first set of electrical conductors passes through the interposer to directly connect the IC non-I/O electrical connectors on the integrated circuit to the system planar; and a second set of electrical conductors in the interposer, wherein the second set of electrical conductors is electrically coupled to IC input/output (I/O) electrical connectors on the integrated circuit, and wherein the second set of electrical conductors traverses through the interposer to the electrical/optical transceiver to convert electrical I/O signals from the integrated circuit into optical I/O signals, wherein only the electrical I/O signals that are destined for a remote device that has been designated as a remote high-speed device are converted into the optical I/O signals, and wherein the remote high-speed device is not mounted on the server blade.