CIRCUIT BOARD AND ELECTRONIC DEVICE,申请号JP20140153949-传众专利搜索

CIRCUIT BOARD AND ELECTRONIC DEVICE

申请公布号：JP2016032032(A)

申请号：JP20140153949

申请日期：2014.07.29

申请公布日期：2016.03.07

申请人：

KYOCERA CORP

发明人：KAYAZONO YOICHI

分类号：H01L23/12;C04B37/02;H01L23/13;H01L23/36;H05K1/02

主分类号：H01L23/12

摘要：PROBLEM TO BE SOLVED: To provide a circuit board and an electronic device, which can improve radiation efficiency while suppressing the occurrence of cracks and the like in an insulating substrate.SOLUTION: A circuit board has an insulating substrate 1, and a copper plate 3 provided on a principal surface of the insulating substrate via a silver-containing bonding material 2. A thickness of the bonding material at a central part of the copper plate is thicker than a thickness of the bonding material at a peripheral part of the copper plate. This can make heat generated at an electronic component 5 be favorably radiated to the insulating substrate 1 side at the central part of the copper plate 3. In addition, since the thickness of the bonding material 2 is thinner on the peripheral part than in the central part of the copper plate 3, diffusion of silver is not likely to occur and stress can be mitigated.SELECTED DRAWING: Figure 1