PRINTED-WIRING BOARD LAMINATE AND METHOD OF MANUFACTURING THE SAME,申请号JP20090269293-传众专利搜索

PRINTED-WIRING BOARD LAMINATE AND METHOD OF MANUFACTURING THE SAME

申请公布号：JP2011114158(A)

申请号：JP20090269293

申请日期：2009.11.26

申请公布日期：2011.06.09

申请人：

SUMITOMO WIRING SYST LTD

发明人：GOTO HIDENORI

分类号：H05K1/14;H05K3/36

主分类号：H05K1/14

摘要：PROBLEM TO BE SOLVED: To provide a printed-wiring board laminate that is easily inserted into a plurality of printed-wiring boards for assembly, positions a connection terminal precisely, is soldered reliably, and has a new structure. SOLUTION: The connection terminal 16 is formed of a wire terminal including a section loosely inserted into any through-holes 14, 14 of the plurality of printed-wiring boards 12a, 12b, a locking projection 22 is formed at one edge 18a of the connection terminal 16, the locking projection 22 is locked to the through-hole 14 of the outermost printed-wiring board 12a in a lamination direction to prescribe an insertion end position of the connection terminal 16, and a projection 28 for centering projecting toward an inner peripheral surface 34 of the through-hole 14 is formed at least in one of insertion positions to the through-holes 14, 14 in the connection terminal 16. COPYRIGHT: (C)2011,JPO&INPIT