成形されたランプソケット,申请号JP20130007245-传众专利搜索

成形されたランプソケット

申请公布号：JP5722926(B2)

申请号：JP20130007245

申请日期：2013.01.18

申请公布日期：2015.05.27

分类号：H01R33/05;H01R33/09;H01R43/24

主分类号：H01R33/05

摘要：A molded lamp socket. The molded lamp socket includes a lamp base body defining a socket cavity with an opening for receiving a lamp bulb. The molded lamp socket also includes a lead extending from a first contact portion disposed in the socket cavity to a second contact portion spaced from the socket cavity. The molded lamp socket also includes a mounting body defining a plug cavity encircling the second contact portion. The mounting body is overmolded with respect to the lamp base body and less than all of the lead, the second contact portion being exposed. The lamp base body is formed from a first plastic with a first level of resistance to out-gassing and the mounting body is formed from a second plastic with a second level of resistance to out-gassing less than the first level of out-gassing.