ACCURATE FILM THICKNESS CONTROL IN GAP-FILL TECHNOLOGY

申请公布号：KR20150126773(A)

申请号：KR20150052371

申请日期：2015.04.14

申请公布日期：2015.11.13

申请人：

APPLIED MATERIALS, INC.

发明人：LI NING;YAN WENBO;NGUYEN VICTOR;TRINH CONG;BALSEANU MIHAELA;XIA LI QUN

分类号：H01L21/314;H01L21/306;H01L21/66;H01L21/768

主分类号：H01L21/314

摘要：Embodiments disclosed in the present invention generally relate to processing of substrates, and more particularly, relate to methods for accurate control of film thickness using deposition-etch cycles. Particularly, embodiments of the present invention may be used in controlling film thickness during filling high aspect ratio features.

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