METHOD OF MANUFACTURING BUMP ELECTRODE,申请号JP20140079262-传众专利搜索

METHOD OF MANUFACTURING BUMP ELECTRODE

申请公布号：JP2015201541(A)

申请号：JP20140079262

申请日期：2014.04.08

申请公布日期：2015.11.12

申请人：

MITSUBISHI MATERIALS CORP

发明人：MINEO KYOHEI;KATASE TAKUMA;ISHIKAWA MASAYUKI

分类号：H01L21/60

主分类号：H01L21/60

摘要：PROBLEM TO BE SOLVED: To manufacture a bump electrode having high bonding reliability by preventing generation of voids due to residual air bubbles in the vicinity of an interface of a base metal layer.SOLUTION: A method of manufacturing a bump electrode includes: a plating step of forming a solder plating layer on a surface of a base metal layer on a substrate by electrolytic plating; and a reflow treatment step of forming a solder bump on the base metal layer by melting the solder plating layer after the plating step. In the reflow treatment step, the solder plating layer is sequentially melted from a lower part in contact with the base metal layer to an upper part.