THIN FILM MATERIAL FOR PROCESSING USE

申请公布号：KR20150122131(A)

申请号：KR20157020738

申请日期：2013.12.27

申请公布日期：2015.10.30

申请人：

TBM CO., LTD.

发明人：SUMI YUICHIRO

分类号：C08J5/18;B32B27/20;C08K3/26;C08K5/098

主分类号：C08J5/18

摘要：<p>본 발명은, 가공 재료를 저렴한 비용으로 효율적으로 도포 또는 증착할 수 있고, 적층된 층이 견고하게 접착되는 기능 가공을 부여하는 무기 물질 분말을 고충전한 플라스틱 박막 재료를 제공한다. 본 발명은, 열가소성 수지와 무기 물질 분말을 중량비 18 : 82 ~ 50 : 50으로 함유하는 가공용 박막 재료로서, 그 비중이 0.60 이상 1.40 이하이며, JIS P 8140에 의한 콥법 흡수도가 0.0g/mㆍ120 초 이상 11.0g/mㆍ120 초 이하이다.</p>

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