应用于马达之转子结构及其制造方法
申请公布号:TWI504105
申请号:TW102148176
申请日期:2013.12.25
申请公布日期:2015.10.11
发明人:许孟原;谢孟如;刘峻豪;王祈欣;林志宏
分类号:H02K1/22;H02K15/02
主分类号:H02K1/22
代理人:李长铭 新北市新店区北新路3段217号3楼
地址:台北市南港区三重路19之9号8楼
主权项:一种应用于马达之转子结构,包含:复数个芯片,系设有复数个位于内侧之固定部与复数个位于外侧之注料部,并且堆叠构成一具有复数个位于内侧之固定槽与复数个位于外侧之注料槽之转子磁芯;复数个金属芯棒,系设置于该些固定槽,并且具有一第一电阻系数;以及复数个金属注料,系注料而设置于该些注料槽,并且具有一第二电阻系数,该第二电阻系数系大于该第一电阻系数;其中,该些芯片系由复数个子芯片所组成,该些子芯片包含有该些固定部中之一者与该些注料部中之一者,并且包含至少一卡合凹部与至少一卡合凸部,该卡合凹部与该卡合凸部用以连结该些子芯片中之二者而构成该些芯片。
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