High power light emitting diode package,申请号EP20070006710-传众专利搜索

High power light emitting diode package

申请公布号：EP1912263(A2)

申请号：EP20070006710

申请日期：2007.03.30

申请公布日期：2008.04.16

申请人：

ALTI-ELECTRONICS CO., LTD.

发明人：KIM, DONG SOO;KIM, DONG SEL

分类号：H01L33/44;H01L33/50;H01L33/58;H01L33/60;H01L33/62

主分类号：H01L33/44

摘要：A high power light emitting diode ("LED") package is disclosed. The high power LED package includes a housing made of an insulating material and having a cavity in its central portion; a lead frame made of a conductive material, including an inner lead exposed by the cavity of the housing and an outer lead extending outside the housing; a heat sink above which the inner lead is placed and having a portion exposed by the cavity of the housing; an LED chip mounted on the exposed portion of the heat sink and electrically connected to the inner lead; a lens portion coupled to the housing to cover the cavity of the housing; and an insulating adhesive sheet interposed between the inner lead and the heat sink for electrically insulating and thermally coupling the inner lead and the heat sink.