Chip packaging module with active cooling mechanisms,申请号US20030733672-传众专利搜索

Chip packaging module with active cooling mechanisms

申请公布号：US2005168947(A1)

申请号：US20030733672

申请日期：2003.12.11

申请公布日期：2005.08.04

申请人：

MOK LAWRENCE S.;BUCHWALTER LEENA P.;BUCHWALTER STEPHEN L.

发明人：MOK LAWRENCE S.;BUCHWALTER LEENA P.;BUCHWALTER STEPHEN L.

分类号：H01L23/427;H01L23/473;H02B1/00;H05K7/20;(IPC1-7):H05K7/20

主分类号：H01L23/427

摘要：The invention is directed to structure and methods of improving the cooling capacity of chip packaging modules. The chip packaging module has a substrate with thin-film wiring on one side and grooves or channels etched on one or both sides where coolant pumps are embedded. The coolant pumps are used to enhance the liquid flowing inside the module. The coolant flows through the chips within the vias in the chips or around the chips when the chips do not have vias. Both cooling modes, single or two-phase modes can be adopted in the module.