FITTING METHOD

申请公布号：JPS62224711(A)

申请号：JP19860066388

申请日期：1986.03.25

申请公布日期：1987.10.02

申请人：

SAITO NAGAO;MITSUBISHI ELECTRIC CORP

发明人：SAITO NAGAO;MORI NAOTAKE

分类号：F16B4/00;B23P19/02

主分类号：F16B4/00

Electrode module for LED lamp

Light-emitting diode (LED) package having flip-chip bonding structure

Semiconductor light emitting element and method for manufacturing the same

Semiconductor light emitting device and method for manufacturing the same

Light-emitting diode and method of fabricating the same

Connector of connecting light sensor and substrate and method of fabricating light sensor

Semiconductor device

Semiconductor device and manufacturing method thereof

Thin film transistor

Low cost demos transistor with improved CHC immunity

Power MOSFET semiconductor

Method for manufacturing dummy gate in gate-last process and dummy gate in gate-last process

Methods for fabricating improved bipolar transistors

Self-aligned bipolar junction transistor having self-planarizing isolation raised base structures

Display apparatus

Method for manufacturing photoelectric conversion device

Solid-state imaging device, method for manufacturing the same, and electronic apparatus to form high-concentration impurity region in semiconductor substrate

Electronic device, method of manufacturing the same, and camera

Imaging systems with baffle grids

Semiconductor device and manufacturing method thereof