WAFER HANDLER AND METHODS OF MANUFACTURE,申请号US201414183989-传众专利搜索

WAFER HANDLER AND METHODS OF MANUFACTURE

申请公布号：US2015235891(A1)

申请号：US201414183989

申请日期：2014.02.19

申请公布日期：2015.08.20

申请人：

INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人：Garant John J.;Griffith Jonathan H.;Hedrick Brittany L.;Sprogis Edmund J.

分类号：H01L21/683;B32B38/10;B32B37/24;H01L21/02;B32B37/26

主分类号：H01L21/683

地址：Armonk NY US

摘要：A wafer handler with a removable bow compensating layer and methods of manufacture is disclosed. The method includes forming at least one layer of stressed material on a front side of a wafer handler. The method further includes forming another stressed material on a backside of the wafer handler which counter balances the at least one layer of stressed material on the front side of the wafer handler, thereby decreasing an overall bow of the wafer handler.

主权项：1. A method comprising: forming at least one layer of stressed material on a front side of a wafer handler; and forming another stressed material on a backside of the wafer handler which counter balances the at least one layer of stressed material on the front side of the wafer handler, thereby decreasing an overall bow of the wafer handler.