ワイヤボンドの接合構造,申请号JP20100232351-传众专利搜索

ワイヤボンドの接合構造

申请公布号：JP5685880(B2)

申请号：JP20100232351

申请日期：2010.10.15

申请公布日期：2015.03.18

申请人：

トヨタ自動車株式会社

发明人：大野裕孝;野澤成行

分类号：H01L25/07;H01L21/60;H01L21/607;H01L25/18

主分类号：H01L25/07

摘要：PROBLEM TO BE SOLVED: To prevent the interference with a joining machine and reduce the size of a semiconductor module.SOLUTION: A joining structure of a wire bond forms bus bars 11 and 13 as a multilevel structure and joins wires 15 and 16 to the bus bars 11 and 13 respectively. More specifically, an upper stage bus bar member 6 including an upper stage bus bar 13 and an upper stage support portion 14 supporting the upper stage bus bar 13 is separately formed from a lower stage bus bar member 5 including a lower stage bus bar 11 and a lower stage support portion 12 supporting the lower stage bus bar 11. The lower stage bus bar 11 is joined to a lower stage wire 15. The upper stage bus bar member 6 is fixed to the lower stage bus bar member 5, and then the upper stage bus bar 13 is joined to the upper stage wire 16. The upper stage bus bar member 6 is fixed to a region on an upper surface of the lower stage bus bar member 5, which excludes areas in the vicinity of a joining portion 15a of the lower stage bus bar 11 and the lower stage wire 15.