ＩＣパッケージの製造方法,申请号JP20100547689-传众专利搜索

ＩＣパッケージの製造方法

申请公布号：JP5656647(B2)

申请号：JP20100547689

申请日期：2009.02.11

申请公布日期：2015.01.21

分类号：H01L23/12;H01L25/00

主分类号：H01L23/12

摘要：<p>Decoupling capacitors are frequently used in computer systems in order to control noise. In general, decoupling capacitors are placed as close as possible to the devices they protect in order to minimize the amount of line inductance and series resistance between the devices and the capacitors. An integrated circuit package includes a substrate (110, 210) having a first surface (111, 211) and an opposing second surface (112, 212), and a die platform (130, 230) adjacent to the first surface of the substrate. The substrate has a recess (120, 220) therein. The integrated circuit package further includes a capacitor (140, 240) in the recess of the substrate. The presence of a recess in the substrate provides an opportunity to reduce the separation distance between a die supported by the die platform and the decoupling capacitors. A further advantage of embodiments of the invention lies in its ability to maintain socket compatibility.</p>