成形体および多数個取り配線基板,申请号JP20110187278-传众专利搜索

成形体および多数個取り配線基板

申请公布号：JP5653323(B2)

申请号：JP20110187278

申请日期：2011.08.30

申请公布日期：2015.01.14

分类号：H05K1/02

主分类号：H05K1/02

摘要：PROBLEM TO BE SOLVED: To provide a multi-piece wiring board that has a most concave or convex region at a center part even when warping, and a molded body for manufacturing the multi-piece wiring board. SOLUTION: The molded body includes a plurality of ceramic green sheets 1 which are rectangular in plan view and include a plurality of wiring board regions 1a arrayed longitudinally and laterally, and metal bodies 2 each of which is buried in each of the plurality of wiring board regions 1a and unevenly distributed in a longitudinal direction in each of the plurality of wiring board regions 1a. The distance from the metal body 2 provided in the wiring board region 1a arranged at a longitudinal upper end to an upper side of a ceramic green sheet 1 is equal to the distance from the metal body 2 provided in the wiring board region 1a arranged at a longitudinal lower end to a lower side of the ceramic green sheet 1. Even if the multi-piece wiring board warps when the molded body is baked into the multi-piece wiring board, an area which becomes most concave or convex is positioned in the center of the multi-piece wiring board. COPYRIGHT: (C)2013,JPO&INPIT