貫通電極基板及びその製造方法,申请号JP20100175286-传众专利搜索

貫通電極基板及びその製造方法

申请公布号：JP5644242(B2)

申请号：JP20100175286

申请日期：2010.08.04

申请公布日期：2014.12.24

分类号：H01L23/32;H01L21/3205;H01L21/768;H01L23/522

主分类号：H01L23/32

摘要：A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole electrodes by filling a conductive material into the plurality of through-holes, forming a first insulation layer on one surface of the substrate, forming a plurality of first openings which expose the plurality of through-hole electrodes corresponding to each of the plurality of through-hole electrodes, on the first insulation layer and correcting a position of the plurality of first openings using the relationship between a misalignment amount of a measured distance value of an open position of a leaning through-hole among the plurality of through-holes and of a design distance value of the open position of the leaning through-hole among the plurality of through-holes with respect to a center position of the substrate.