射出成形方法及び装置,申请号JP20100213359-传众专利搜索

射出成形方法及び装置

申请公布号：JP5625673(B2)

申请号：JP20100213359

申请日期：2010.09.24

申请公布日期：2014.11.19

分类号：B29C45/76;B29C45/14;B29C45/64

主分类号：B29C45/76

摘要：PROBLEM TO BE SOLVED: To perform mold forming without damaging a substrate by clamping the substrate with an adequate mold clamping load. SOLUTION: This apparatus includes a mold 100, a mold clamping mechanism 110 and an injection mechanism 120, inserts the substrate 10 mounted with an electronic component 7 between divided faces of the mold, clamps the substrate 10 with a mold clamping load FO at which the mold is closed and clamped, and injects molding resin 2 into a cavity 17 formed between the divided faces of the mold 100, thereby performs resin molding of the electronic component 7 mounted on the substrate 10. The injection molding apparatus further includes: a mold clamping load measuring instrument 13; an injection load measuring instrument 5 for measuring an injection load F2 in a direction opposite from the mold clamping load F0 corresponding to injection pressure acting on the mold when the mold is closed and the injection resin is injected into the cavity; and a control means for controlling the mold clamping load F0 within the tolerable range based on the measured data by the mold clamping load measuring instrument 13 and the measured data by the injection load measuring instrument 5. COPYRIGHT: (C)2012,JPO&INPIT