RESIN COMPOSITION, PRIMER LAYER FOR PLATING PROCESS, PRIMER LAYER FOR PLATING PROCESS WITH SUPPORT BODY, PRIMER LAYER FOR PLATING PROCESS AFTER CURING, LAMINATE SHEET FOR WIRING BOARD, PROCESS OF MANUFACTURING LAMINATE SHEET FOR WIRING BOARD, MULTILAYER WIRING BOARD, AND PROCESS OF MANUFACTURING MULTILAYER WIRING BOARD

申请公布号：JP2014187358(A)

申请号：JP20140030664

申请日期：2014.02.20

申请公布日期：2014.10.02

申请人：

HITACHI CHEMICAL CO LTD

发明人：YAMADA KUNPEI;FUJIMOTO DAISUKE;IWAKURA TETSUO;KANEKO YOICHI;MURAI HIKARI

分类号：H05K3/18;B32B27/38;H05K3/46

主分类号：H05K3/18

摘要：<p>PROBLEM TO BE SOLVED: To provide a resin composition forming a primer layer for a plating process, excellent in high adhesive force with electroless plating copper even for a resin surface of small surface roughness, having excellent laser workability.SOLUTION: The resin composition includes (A) a multifunctional epoxy resin, (B) an epoxy resin curative agent, (C) a polybutadiene modified polyamide resin containing a phenolic hydroxyl group, and (D) an alumina filler.</p>

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