PRE-TREATMENT METHOD FOR ACQUIRING GOLD FOR CLEANING OF COPPER BASIC MATERIAL,申请号KR20130051424-传众专利搜索

PRE-TREATMENT METHOD FOR ACQUIRING GOLD FOR CLEANING OF COPPER BASIC MATERIAL

申请公布号：KR101445252(B1)

申请号：KR20130051424

申请日期：2013.05.07

申请公布日期：2014.09.29

申请人：

BEYOND CO., LTD.

发明人：KIM, YOUNG AN;LEE, SEUNG HO;OH, DU HWAN

分类号：C22B11/00;C22B7/00;C22B9/02

主分类号：C22B11/00

摘要：The present invention relates to technology to dissolve metal materials by putting a copper basic material of a state, where the metal materials are laminated on the copper basic material through a pattern process, in potassium hydroxide (KOH) and hydrochloric acid (HCI) solution which can maintain strong chemical resistance to gold and copper, and to maintain a separated structure of non-dissolved gold from the copper basic material, thereby effectively separating gold of a solid state and recycling a copper basic material after being cleaned. According to the present invention, the pretreatment method for recovery of gold can minimize a loss of the copper basic material by dipping the copper basic material in the potassium hydroxide and hydrochloric acid solution which maintains strong chemical resistance to gold and copper so as to enhance a regeneration rate and effectively recover gold of non-dissolved state which is laminated on the outer surface of the copper basic material.