PHOTOSENSITIVE COMPOSITION, RESIN COMPOSITION, CURED FILM AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT,申请号KR20130163538-传众专利搜索

PHOTOSENSITIVE COMPOSITION, RESIN COMPOSITION, CURED FILM AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT

申请公布号：KR20140104898(A)

申请号：KR20130163538

申请日期：2013.12.26

申请公布日期：2014.08.29

申请人：

JSR CORPORATION

发明人：SAKURAI TOMOHIKO;HANAMURA MASAAKI

分类号：G03F7/004;G03F7/022;G03F7/11

主分类号：G03F7/004

摘要：The objective of the present invention is to improve the curing properties of a resin composition and a photosensitive composition appropriately used for forming a surface passivation layer and an insulating interlayer included in an electronic part and the like, and to decrease internal stress remaining in a substrate when a cured layer is formed on the substrate using the compositions. A photosensitive composition includes (A) a resin containing a phenolic hydroxide group, (B1) a cross-linking agent containing at least two oxazoline groups, (B2) a cross-linking agent containing at least two groups represented by -CH_2OR (where R is a hydrogen atom, a C1-C10 alkyl group or acetyl group), and (C) a photosensitive acid generator.