COPPER FOIL WITH ADHESIVE LAYER, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD,申请号KR20147018973-传众专利搜索

COPPER FOIL WITH ADHESIVE LAYER, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD

申请公布号：KR20140102736(A)

申请号：KR20147018973

申请日期：2013.01.11

申请公布日期：2014.08.22

申请人：

MITSUI MINING & SMELTING CO., LTD.

发明人：MATSUSHIMA TOSHIFUMI;SATO TETSURO;HOSOKAWA MAKOTO;OSAWA KAZUHIRO

分类号：H05K3/38;B32B15/08;H05K1/09

主分类号：H05K3/38

摘要：<p>The purpose of the present invention is to provide: a copper foil with an adhesive layer, which has sufficient peel strength and high resistance to a desmear solution, while being suppressed in deterioration due to moisture absorption; a copper-clad laminate; and a printed wiring board. In order to achieve this purpose, a copper foil with an adhesive layer, which is provided with an adhesive layer on one surface of a copper foil, is configured such that the adhesive layer is composed of a resin composition that contains from 5 parts by mass to 65 parts by mass (inclusive) of a styrene butadiene block copolymer per 100 parts by mass of a polyphenylene ether compound. Also provided are: a copper-clad laminate which is obtained using this copper foil with an adhesive layer; and a printed wiring board which is characterized by being obtained using this copper-clad laminate.</p>